CLIC X-Band Technologies

Theoretical studies of the breakdown phenomena of copper under high electric field. Multiscale computer simulatons, finite element method (FEM) and molecular dynamics (MD) are applied to study the phenomena. Current methodology allows to simulate nanoscale material effects in case of fully coupled thermal, electrical and mechanical interactions using FEM, application of MD allows to increase accuracy othervise inaccesible with FEM only.  Current studies are concentrated to the DC electric fields, while he studies with the AC fields are forseen in the future.